Main Product
With the rapid popularization of products such as mobile phones and flat-screen televisions, there is a rising demand for two-layer CCLs.
Older technologies, however, are limited in how thin the final product can be due to the use of adhesives and copper foil.
Another problem with such technologies is that nickel and chrome are used in the seed layer for plating copper on the polyimide, limiting how fine the circuit pattern can be because of the residue generated during etching.
Furthermore, there are functional issues such as degradation of frequency characteristics, lowered adhesion and the burden on the environment.
By using a silicon compound in the seed layer, Metal Finishing System solved these problems in one stroke, allowing thinner products and higher precision while decreasing the environmental burden, a truly revolutionary innovation.
Production Systems for Chromeless Silicon Barrier Two-layer CCLs
Sputtering Devices
Company Information
Designated by the Ministry of Economy, Trade and Industry in 2007 to work on its Strategic Fundamental Technology Advancement program, Metal Finishing System developed its production system for chromeless silicon barrier two-layer copper-clad laminates (CCLs).
They are currently working on developing their production system for an even wider range of applications including mobile phones, flat-screen televisions and personal information devices.
| Company Name | METAL FINISHING SYSTEM CO., LTD. |
|---|---|
| Address | 6-7-24 Kano, Higashi-Osaka-City, Osaka, 577-0901, Japan |
| Phone Number | +81-(0)72-816-1230 |
| Fax Number | +81-(0)72-816-1231 |
| Company URL | http://www.mfs-net.co.jp/index.html (Japanese Only) |
| Main Lines of Business | Machinery manufacturing |
| Foundation | 1983 |
| Number of Employees | 25 |
| Capital | 70,500,000 yen |
| Sales strengths such as international standards, industrial standards, etc. | Selected as one of the 300 most active manufacturers in 2007 by the Small and Medium Enterprise Agency |
| Machinery and Facilities | Sputtering devices, roll-to-roll copper plating systems, other devices |
| Patents Held | Multiple patents for surface treatment methods and devices involving applications such as semiconductors, electronic components and automobile parts Multiple patents for chromeless two-layer CCLs |
| Others, products made in-house | Surface treatment automation equipment for in-house manufacturing Compact, thin electronic components and substrates |
